Measurement of the bonding energy via non-planar direct bonding

An accurate measurement of the bonding energy an interface is important in many areas applied research. We present a novel method for measuring energy, which based on principle non-planar direct bonding, i.e., originally planar wafers onto substrates. discuss detail advantages and disadvantages compared to commonly used double cantilever beam method. To demonstrate practical relevance, by using example glass wafers, evolution during different de-bonding steps investigated, focusing how surface shape variations roughness affects water stress corrosion. find that corroded state not affected original mid-spatial frequency range roughness, anymore. A molecular mechanism explain this phenomenon proposed.